In recent years, the increasing functionality and density of semiconductor devices has led to a steady increase in the amount of heat that the devices generate. Because of this, technology that efficiently dissipates the heat generated by each individual part is becoming indispensable.
Conventionally, devices are attached directly to heat sinks, which dissipate excess heat. However, creating a heat dissipation structure inside of the Printed Circuit Board increases heat dissipation, reduces manufacturing costs, and stabilizes performance. This paper explains the methods and technology used to create this internal heat dissipation structure.